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# 2514/U, 7th 'A' Main Road, Opp. to BBMP Swimming Pool, Hampinagar, Vijayanagar 2nd Stage. Bangalore, IN
+918023404924 https://www.tenettech.com/s/59c9e4669bd3e7c70c5f5e6c/ms.settings/5256837ccc4abf1d39000001/59dafe26aef6e1d20402c4c3-480x480.png" [email protected]
5ba1e5cd77375ae9b29d2905 MYC-AM335X CPU Module (industrial, 256MB DDR3, 256MB Flash) https://www.tenettech.com/s/59c9e4669bd3e7c70c5f5e6c/ms.products/5ba1e5cd77375ae9b29d2905/images/5ba1e5cd77375ae9b29d2906/5ba1df688e3ccd3675a83d64/5ba1df688e3ccd3675a83d64.jpg

Measuring only 70mm by 50mm, the MYC-AM335X is a highly-integrated low-cost ARM embedded SOM (System on Module) supporting Texas Instruments (TI) Sitara AM335x (AM3352AM3354AM3356AM3357AM3358 and AM3359ARM Cortex-A8 processors, featuring PowerVR™ SGX530 for 2D and 3D graphics acceleration as well as PRU/ICSS supporting real-time protocols such as EtherCAT, PROFINET, EtherNet/IP, PROFIBUS, Ethernet Powerlink, Sercos, and others.

The MYC-AM335X CPU Module has integrated the AM335x processor, 512MB DDR3 SDRAM, 512MB Nand Flash and Gigabit Ethernet PHY chip on board and can be served as the core of your embedded system. It has two 2.0mm pitch 60-pin male expansion connectors for interconnecting with your base board, thus providing an interface for the base board to carry most of the I/O signals to and from the CPU module. One 2.0mm pitch 26-pin interface and one 2.54mm pitch 10-pin interface are also designed with only reserved solder joints which have extended a few signals for some special purpose.

Features

  • Dimensions: 70mm x 50mm
  • PCB Layers: 6-layer design
  • Power supply: +3.3V/0.8A
  • Working temperature: 0~70 Celsius (commercial grade) or -40~85 Celsius (industrial grade)
  • Linux 4.1.18
  • TI AM3352, AM3354, AM3356, AM3357, AM3358, AM3359 (pin-to-pin compatible, 15x15 mm, 0.8-mm ball pitch, ZCZ package)
    - 800-MHz ARM Cortex-A8 32-bit RISC MPU (Up to 1GHz)
    - NEON™ SIMD Coprocessor
    - 32KB/32KB of L1 Instruction/Data Cache with Single-Error Detection (parity)
    - 256KB of L2 Cache with Error Correcting Code (ECC)
    - SGX530 Graphics Engine
    - Programmable Real-Time Unit Subsystem
  • 512MB DDR3 SDRAM
  • 512MB Nand Flash

Peripherals and Signals Routed to Pins

  • On-board Gigabit Ethernet PHY
  • One power indicator (Red LED)
  • One user LED (Green)
  • Two 2.0mm pitch 60-pin expansion connectors can carry out interfaces below 
    - 2 x USB2.0 OTG ports
    - 6 x Serial ports
    - 2 x I2C
    - 1 x SPI
    - 7 x ADC
    - 2 x PWM
    - 3 x SDIO
  • One 2.0mm pitch 26-pin expansion interface
  • One 2.54mm pitch 10-pin expansion interface
MYC-CAM3358-256N256D-100-I
in stockINR 9239.4
1 1
MYC-AM335X CPU Module  (industrial, 256MB DDR3, 256MB Flash)

MYC-AM335X CPU Module (industrial, 256MB DDR3, 256MB Flash)

Sku: MYC-CAM3358-256N256D-100-I
₹9,239.4


Sold By: tenettech

Description of product

Measuring only 70mm by 50mm, the MYC-AM335X is a highly-integrated low-cost ARM embedded SOM (System on Module) supporting Texas Instruments (TI) Sitara AM335x (AM3352AM3354AM3356AM3357AM3358 and AM3359ARM Cortex-A8 processors, featuring PowerVR™ SGX530 for 2D and 3D graphics acceleration as well as PRU/ICSS supporting real-time protocols such as EtherCAT, PROFINET, EtherNet/IP, PROFIBUS, Ethernet Powerlink, Sercos, and others.

The MYC-AM335X CPU Module has integrated the AM335x processor, 512MB DDR3 SDRAM, 512MB Nand Flash and Gigabit Ethernet PHY chip on board and can be served as the core of your embedded system. It has two 2.0mm pitch 60-pin male expansion connectors for interconnecting with your base board, thus providing an interface for the base board to carry most of the I/O signals to and from the CPU module. One 2.0mm pitch 26-pin interface and one 2.54mm pitch 10-pin interface are also designed with only reserved solder joints which have extended a few signals for some special purpose.

Features

  • Dimensions: 70mm x 50mm
  • PCB Layers: 6-layer design
  • Power supply: +3.3V/0.8A
  • Working temperature: 0~70 Celsius (commercial grade) or -40~85 Celsius (industrial grade)
  • Linux 4.1.18
  • TI AM3352, AM3354, AM3356, AM3357, AM3358, AM3359 (pin-to-pin compatible, 15x15 mm, 0.8-mm ball pitch, ZCZ package)
    - 800-MHz ARM Cortex-A8 32-bit RISC MPU (Up to 1GHz)
    - NEON™ SIMD Coprocessor
    - 32KB/32KB of L1 Instruction/Data Cache with Single-Error Detection (parity)
    - 256KB of L2 Cache with Error Correcting Code (ECC)
    - SGX530 Graphics Engine
    - Programmable Real-Time Unit Subsystem
  • 512MB DDR3 SDRAM
  • 512MB Nand Flash

Peripherals and Signals Routed to Pins

  • On-board Gigabit Ethernet PHY
  • One power indicator (Red LED)
  • One user LED (Green)
  • Two 2.0mm pitch 60-pin expansion connectors can carry out interfaces below 
    - 2 x USB2.0 OTG ports
    - 6 x Serial ports
    - 2 x I2C
    - 1 x SPI
    - 7 x ADC
    - 2 x PWM
    - 3 x SDIO
  • One 2.0mm pitch 26-pin expansion interface
  • One 2.54mm pitch 10-pin expansion interface