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# 2514/U, 7th 'A' Main Road, Opp. to BBMP Swimming Pool, Hampinagar, Vijayanagar 2nd Stage. 560104 Bangalore IN
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# 2514/U, 7th 'A' Main Road, Opp. to BBMP Swimming Pool, Hampinagar, Vijayanagar 2nd Stage. Bangalore, IN
+918023404924 https://www.tenettech.com/s/59c9e4669bd3e7c70c5f5e6c/ms.settings/5256837ccc4abf1d39000001/59dafe26aef6e1d20402c4c3-480x480.png" [email protected]
66cf1e025b697704c0a6207a Boyd Laconia, LLC HS485-ND https://www.tenettech.com/s/59c9e4669bd3e7c70c5f5e6c/66cf1e035b697704c0a6207d/342949.jpg

COPPER HEATSINK 80X80X12MM

Product Attributes:

Series -
Product Status Active
Type Top Mount, Skived
Package Cooled BGA
Attachment Method Push Pin
Shape Square, Fins
Length 3.150" (80.00mm)
Width 3.150" (80.00mm)
Diameter -
Fin Height 0.472" (12.00mm)
Power Dissipation @ Temperature Rise -
Thermal Resistance @ Forced Air Flow 1.20°C/W @ 200 LFM
Thermal Resistance @ Natural 5.10°C/W
Material Copper
Material Finish AavSHIELD 3C
TT-DKEY-HS485-ND
in stock INR 6397.919999999999
Boyd Laconia, LLC
1 1
Boyd Laconia, LLC HS485-ND

Boyd Laconia, LLC HS485-ND

Sku: TT-DKEY-HS485-ND
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₹6,397.92
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Description of product

COPPER HEATSINK 80X80X12MM

Product Attributes:

Series -
Product Status Active
Type Top Mount, Skived
Package Cooled BGA
Attachment Method Push Pin
Shape Square, Fins
Length 3.150" (80.00mm)
Width 3.150" (80.00mm)
Diameter -
Fin Height 0.472" (12.00mm)
Power Dissipation @ Temperature Rise -
Thermal Resistance @ Forced Air Flow 1.20°C/W @ 200 LFM
Thermal Resistance @ Natural 5.10°C/W
Material Copper
Material Finish AavSHIELD 3C

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