http://base-store.storehippo.com/
# 2514/U, 7th 'A' Main Road, Opp. to BBMP Swimming Pool, Hampinagar, Vijayanagar 2nd Stage. 560104 Bangalore IN
Tenettech E-Store http://base-store.storehippo.com/# 2514/U, 7th 'A' Main Road, Opp. to BBMP Swimming Pool, Hampinagar, Vijayanagar 2nd Stage. Bangalore, IN
+918023404924 https://www.tenettech.com/s/59c9e4669bd3e7c70c5f5e6c/ms.settings/5256837ccc4abf1d39000001/59dafe26aef6e1d20402c4c3-480x480.png" [email protected] 66cf1d82dfbbd30024c24eb7 Boyd Laconia, LLC HS326-ND https://www.tenettech.com/s/59c9e4669bd3e7c70c5f5e6c/66cf1d83dfbbd30024c24eba/374724b60024.jpg HEATSINK BGA W/O SOLDER ANCHORS
Product Attributes:
| Series | - |
| Product Status | Active |
| Type | Top Mount |
| Package Cooled | BGA |
| Attachment Method | Solder Anchor |
| Shape | Square, Pin Fins |
| Length | 1.378" (35.00mm) |
| Width | 1.378" (35.00mm) |
| Diameter | - |
| Fin Height | 0.709" (18.00mm) |
| Power Dissipation @ Temperature Rise | 3.0W @ 50°C |
| Thermal Resistance @ Forced Air Flow | 5.20°C/W @ 200 LFM |
| Thermal Resistance @ Natural | 15.30°C/W |
| Material | Aluminum |
| Material Finish | Black Anodized |
TT-DKEY-HS326-NDin stockINR
Boyd Laconia, LLC
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