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# 2514/U, 7th 'A' Main Road, Opp. to BBMP Swimming Pool, Hampinagar, Vijayanagar 2nd Stage. Bangalore, IN
+918023404924 https://www.tenettech.com/s/59c9e4669bd3e7c70c5f5e6c/ms.settings/5256837ccc4abf1d39000001/59dafe26aef6e1d20402c4c3-480x480.png" [email protected]
66cf1ee53ac807047ac1649e CTS Thermal Management Products 294-1098-ND https://www.tenettech.com/s/59c9e4669bd3e7c70c5f5e6c/66cf1ee73ac807047ac164a6/bdn10-3cba01.jpg

HEATSINK CPU W/ADHESIVE 1.01"SQ

Product Attributes:

Series BDN
Product Status Active
Type Top Mount
Package Cooled Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method Thermal Tape, Adhesive (Included)
Shape Square, Pin Fins
Length 1.010" (25.65mm)
Width 1.010" (25.65mm)
Diameter -
Fin Height 0.355" (9.02mm)
Power Dissipation @ Temperature Rise -
Thermal Resistance @ Forced Air Flow 8.00°C/W @ 400 LFM
Thermal Resistance @ Natural 26.40°C/W
Material Aluminum
Material Finish Black Anodized
TT-DKEY-294-1098-ND
in stock INR
CTS Thermal Management Products
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CTS Thermal Management Products 294-1098-ND

CTS Thermal Management Products 294-1098-ND

Sku: TT-DKEY-294-1098-ND
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Description of product

HEATSINK CPU W/ADHESIVE 1.01"SQ

Product Attributes:

Series BDN
Product Status Active
Type Top Mount
Package Cooled Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method Thermal Tape, Adhesive (Included)
Shape Square, Pin Fins
Length 1.010" (25.65mm)
Width 1.010" (25.65mm)
Diameter -
Fin Height 0.355" (9.02mm)
Power Dissipation @ Temperature Rise -
Thermal Resistance @ Forced Air Flow 8.00°C/W @ 400 LFM
Thermal Resistance @ Natural 26.40°C/W
Material Aluminum
Material Finish Black Anodized

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