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# 2514/U, 7th 'A' Main Road, Opp. to BBMP Swimming Pool, Hampinagar, Vijayanagar 2nd Stage. Bangalore, IN
+918023404924 https://www.tenettech.com/s/59c9e4669bd3e7c70c5f5e6c/ms.settings/5256837ccc4abf1d39000001/59dafe26aef6e1d20402c4c3-480x480.png" [email protected]
66cf1d5adfbbd30024c24dd0 CUI Devices 2223-HSE06-503045-ND https://www.tenettech.com/s/59c9e4669bd3e7c70c5f5e6c/66cf1d5cdfbbd30024c24dd3/mfg_hse06-503045.jpg

HEAT SINK, EXTRUSION, TO-218/TO-

Product Attributes:

Series HSE
Product Status Active
Type Board Level
Package Cooled TO-218, TO-220
Attachment Method Clip
Shape Rectangular, Fins
Length 1.969" (50.00mm)
Width 1.181" (30.00mm)
Diameter -
Fin Height 1.772" (45.00mm)
Power Dissipation @ Temperature Rise 12.79W @ 75°C
Thermal Resistance @ Forced Air Flow 2.10°C/W @ 200 LFM
Thermal Resistance @ Natural 5.86°C/W
Material Aluminum Alloy
Material Finish Black Anodized
TT-DKEY-2223-HSE06-503045-ND
in stock INR 237.59999999999997
CUI Devices
1 1
CUI Devices 2223-HSE06-503045-ND

CUI Devices 2223-HSE06-503045-ND

Sku: TT-DKEY-2223-HSE06-503045-ND
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₹237.6
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Description of product

HEAT SINK, EXTRUSION, TO-218/TO-

Product Attributes:

Series HSE
Product Status Active
Type Board Level
Package Cooled TO-218, TO-220
Attachment Method Clip
Shape Rectangular, Fins
Length 1.969" (50.00mm)
Width 1.181" (30.00mm)
Diameter -
Fin Height 1.772" (45.00mm)
Power Dissipation @ Temperature Rise 12.79W @ 75°C
Thermal Resistance @ Forced Air Flow 2.10°C/W @ 200 LFM
Thermal Resistance @ Natural 5.86°C/W
Material Aluminum Alloy
Material Finish Black Anodized

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