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Tenettech E-Store
# 2514/U, 7th 'A' Main Road, Opp. to BBMP Swimming Pool, Hampinagar, Vijayanagar 2nd Stage. Bangalore, IN
+918023404924 https://www.tenettech.com/s/59c9e4669bd3e7c70c5f5e6c/ms.settings/5256837ccc4abf1d39000001/59dafe26aef6e1d20402c4c3-480x480.png" [email protected]
66cf1dc55b697704c0a61f1e CUI Devices 2223-HSB41-303014P-ND https://www.tenettech.com/s/59c9e4669bd3e7c70c5f5e6c/66cf1dc65b697704c0a61f21/mfg_hsb41-303014p.jpg

HEAT SINK, BGA, 30 X 30 X 10 MM,

Product Attributes:

Series HSB
Product Status Active
Type Top Mount
Package Cooled BGA
Attachment Method Push Pin
Shape Square, Pin Fins
Length 1.181" (30.00mm)
Width 1.181" (30.00mm)
Diameter -
Fin Height 0.551" (14.00mm)
Power Dissipation @ Temperature Rise 5.9W @ 75°C
Thermal Resistance @ Forced Air Flow 4.30°C/W @ 200 LFM
Thermal Resistance @ Natural 12.63°C/W
Material Aluminum Alloy
Material Finish Black Anodized
TT-DKEY-2223-HSB41-303014P-ND
in stock INR
CUI Devices
1 1
CUI Devices 2223-HSB41-303014P-ND

CUI Devices 2223-HSB41-303014P-ND

Sku: TT-DKEY-2223-HSB41-303014P-ND
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Description of product

HEAT SINK, BGA, 30 X 30 X 10 MM,

Product Attributes:

Series HSB
Product Status Active
Type Top Mount
Package Cooled BGA
Attachment Method Push Pin
Shape Square, Pin Fins
Length 1.181" (30.00mm)
Width 1.181" (30.00mm)
Diameter -
Fin Height 0.551" (14.00mm)
Power Dissipation @ Temperature Rise 5.9W @ 75°C
Thermal Resistance @ Forced Air Flow 4.30°C/W @ 200 LFM
Thermal Resistance @ Natural 12.63°C/W
Material Aluminum Alloy
Material Finish Black Anodized

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