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# 2514/U, 7th 'A' Main Road, Opp. to BBMP Swimming Pool, Hampinagar, Vijayanagar 2nd Stage. Bangalore, IN
+918023404924 https://www.tenettech.com/s/59c9e4669bd3e7c70c5f5e6c/ms.settings/5256837ccc4abf1d39000001/59dafe26aef6e1d20402c4c3-480x480.png" [email protected]
66cf1df0dfbbd30024c250ee CUI Devices 2223-HSB28-606022-ND https://www.tenettech.com/s/59c9e4669bd3e7c70c5f5e6c/66cf1df0dfbbd30024c250f1/mfg_hsb28-606022.jpg

HEAT SINK, BGA, 60 X 60 X 22 MM,

Product Attributes:

Series HSB
Product Status Active
Type Top Mount
Package Cooled BGA
Attachment Method Push Pin
Shape Square, Pin Fins
Length 2.362" (60.00mm)
Width 2.362" (60.00mm)
Diameter -
Fin Height 0.866" (22.00mm)
Power Dissipation @ Temperature Rise 15.83W @ 75°C
Thermal Resistance @ Forced Air Flow 1.40°C/W @ 200 LFM
Thermal Resistance @ Natural 4.74°C/W
Material Aluminum Alloy
Material Finish Black Anodized
TT-DKEY-2223-HSB28-606022-ND
in stock INR 954.72
CUI Devices
1 1
CUI Devices 2223-HSB28-606022-ND

CUI Devices 2223-HSB28-606022-ND

Sku: TT-DKEY-2223-HSB28-606022-ND
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₹954.72
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Description of product

HEAT SINK, BGA, 60 X 60 X 22 MM,

Product Attributes:

Series HSB
Product Status Active
Type Top Mount
Package Cooled BGA
Attachment Method Push Pin
Shape Square, Pin Fins
Length 2.362" (60.00mm)
Width 2.362" (60.00mm)
Diameter -
Fin Height 0.866" (22.00mm)
Power Dissipation @ Temperature Rise 15.83W @ 75°C
Thermal Resistance @ Forced Air Flow 1.40°C/W @ 200 LFM
Thermal Resistance @ Natural 4.74°C/W
Material Aluminum Alloy
Material Finish Black Anodized

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