http://base-store.storehippo.com/
# 2514/U, 7th 'A' Main Road, Opp. to BBMP Swimming Pool, Hampinagar, Vijayanagar 2nd Stage.
560104
Bangalore
IN
Tenettech E-Store
http://base-store.storehippo.com/
# 2514/U, 7th 'A' Main Road, Opp. to BBMP Swimming Pool, Hampinagar, Vijayanagar 2nd Stage.
Bangalore,
IN
+918023404924
https://www.tenettech.com/s/59c9e4669bd3e7c70c5f5e6c/ms.settings/5256837ccc4abf1d39000001/59dafe26aef6e1d20402c4c3-480x480.png"
[email protected]
66cf1df0dfbbd30024c250ee
CUI Devices 2223-HSB28-606022-ND
https://www.tenettech.com/s/59c9e4669bd3e7c70c5f5e6c/66cf1df0dfbbd30024c250f1/mfg_hsb28-606022.jpg
HEAT SINK, BGA, 60 X 60 X 22 MM,
Product Attributes:
| Series |
HSB |
| Product Status |
Active |
| Type |
Top Mount |
| Package Cooled |
BGA |
| Attachment Method |
Push Pin |
| Shape |
Square, Pin Fins |
| Length |
2.362" (60.00mm) |
| Width |
2.362" (60.00mm) |
| Diameter |
- |
| Fin Height |
0.866" (22.00mm) |
| Power Dissipation @ Temperature Rise |
15.83W @ 75°C |
| Thermal Resistance @ Forced Air Flow |
1.40°C/W @ 200 LFM |
| Thermal Resistance @ Natural |
4.74°C/W |
| Material |
Aluminum Alloy |
| Material Finish |
Black Anodized |
TT-DKEY-2223-HSB28-606022-ND
in stock
INR
CUI Devices
1
1