The TB-RK3399Pro development board is equipped with the super-performance AI processor RK3399Pro, which has superior general-purpose computing performance. It equips ARM big.LITTLE architecture, dual-core Cortex-A72 + quad-core Cortex-A53, with technical leadership in overall performance and power consumption; quad-core ARM high-end GPU Mali-T860, integrates multiple bandwidth compression technology, providing overall excellent performance. Its on-chip NPU (Neural Network Processor) offers up to 3.0TOPs computing power.
The TB-RK3399Pro development board is equipped with the super-performance AI processor RK3399Pro, which has superior general-purpose computing performance. It equips ARM big.LITTLE architecture, dual-core Cortex-A72 + quad-core Cortex-A53, with technical leadership in overall performance and power consumption; quad-core ARM high-end GPU Mali-T860, integrates multiple bandwidth compression technology, providing overall excellent performance. Its on-chip NPU (Neural Network Processor) offers up to 3.0TOPs computing power.
The TB-RK3399Pro development board has rich external interfaces, including 4 lanes PCIE and Mini PCIE, dual high-speed USB3.0 port Type-C + USB3.0 Type-A, dual MIPI CSI and dual ISP with pixel processing capability up to 1300W pixels, and HDMI2.1, DP1.2, MIPI-DSI and EDP; it also supports 8-channel digital microphone array input.
| CPU | Big.Little architecture: Dual Cortex-A72 + Quad Cortex-A53, 64-bit CPU |
| Frequency is up to 1.8GHz | |
| NPU | Support 8-bit/16-bit Inference |
| Support TensorFlow/Caffe Model | |
| GPU | Mali-T860MP4 GPU, OpenGL ES1.1/2.0/3.0/3.1, OpenVG1.1, OpenCL, DX11 |
| Supports AFBC (ARM Frame Buffer Compression) | |
| Memory | 3GB/6GB LPDDR3 |
| Support eMMC 5.1 with HS400, SDIO 3.0 with HS200 | |
| Multi-Media | 4K VP9 and 4K 10bits H265/H264 video decoders, up to 60fps |
| 1080P other video decoders (VC-1, MPEG-1/2/4, VP8) | |
| 1080P video encoders for H.264 and VP8 | |
| Video post processor: de-interlace, de-noise, enhancement for edge/detail/color | |
| Display | Dual VOP: one supports 4096x2160 with AFBC supported; the other supports 2560x1600 |
| Dual channel MIPI-DSI (4 lanes per channel) | |
| eDP 1.3 (4 lanes with 10.8Gbps) to support display, with PSR | |
| HDMI 2.0 for 4K 60Hz with HDCP 1.4/2.2 | |
| DisplayPort 1.2 (4 lanes, up to 4K 60Hz) | |
| Supports Rec.2020 and conversion to Rec.709 | |
| Interface | Dual 13M ISP and dual channel MIPI CSI-2 receive interface |
| USB 3.0 with type-C supported | |
| PCIe 2.1 (4 full-duplex lanes) | |
| Embedded low power MCU for other application | |
| 8 channels I2S supports 8 channels RX or 8 channels TX |
Shipping list:
1 x TB-RK3399Pro development board with Heatsink (3G+16G eMMC)
1 x Acrylic case with screws
1 x 12V-2A power supply
1 x Type C cable
TT-SDK-110110064
The TB-RK3399Pro development board is equipped with the super-performance AI processor RK3399Pro, which has superior general-purpose computing performance. It equips ARM big.LITTLE architecture, dual-core Cortex-A72 + quad-core Cortex-A53, with technical leadership in overall performance and power consumption; quad-core ARM high-end GPU Mali-T860, integrates multiple bandwidth compression technology, providing overall excellent performance. Its on-chip NPU (Neural Network Processor) offers up to 3.0TOPs computing power.
The TB-RK3399Pro development board is equipped with the super-performance AI processor RK3399Pro, which has superior general-purpose computing performance. It equips ARM big.LITTLE architecture, dual-core Cortex-A72 + quad-core Cortex-A53, with technical leadership in overall performance and power consumption; quad-core ARM high-end GPU Mali-T860, integrates multiple bandwidth compression technology, providing overall excellent performance. Its on-chip NPU (Neural Network Processor) offers up to 3.0TOPs computing power.
The TB-RK3399Pro development board has rich external interfaces, including 4 lanes PCIE and Mini PCIE, dual high-speed USB3.0 port Type-C + USB3.0 Type-A, dual MIPI CSI and dual ISP with pixel processing capability up to 1300W pixels, and HDMI2.1, DP1.2, MIPI-DSI and EDP; it also supports 8-channel digital microphone array input.
| CPU | Big.Little architecture: Dual Cortex-A72 + Quad Cortex-A53, 64-bit CPU |
| Frequency is up to 1.8GHz | |
| NPU | Support 8-bit/16-bit Inference |
| Support TensorFlow/Caffe Model | |
| GPU | Mali-T860MP4 GPU, OpenGL ES1.1/2.0/3.0/3.1, OpenVG1.1, OpenCL, DX11 |
| Supports AFBC (ARM Frame Buffer Compression) | |
| Memory | 3GB/6GB LPDDR3 |
| Support eMMC 5.1 with HS400, SDIO 3.0 with HS200 | |
| Multi-Media | 4K VP9 and 4K 10bits H265/H264 video decoders, up to 60fps |
| 1080P other video decoders (VC-1, MPEG-1/2/4, VP8) | |
| 1080P video encoders for H.264 and VP8 | |
| Video post processor: de-interlace, de-noise, enhancement for edge/detail/color | |
| Display | Dual VOP: one supports 4096x2160 with AFBC supported; the other supports 2560x1600 |
| Dual channel MIPI-DSI (4 lanes per channel) | |
| eDP 1.3 (4 lanes with 10.8Gbps) to support display, with PSR | |
| HDMI 2.0 for 4K 60Hz with HDCP 1.4/2.2 | |
| DisplayPort 1.2 (4 lanes, up to 4K 60Hz) | |
| Supports Rec.2020 and conversion to Rec.709 | |
| Interface | Dual 13M ISP and dual channel MIPI CSI-2 receive interface |
| USB 3.0 with type-C supported | |
| PCIe 2.1 (4 full-duplex lanes) | |
| Embedded low power MCU for other application | |
| 8 channels I2S supports 8 channels RX or 8 channels TX |
Shipping list:
1 x TB-RK3399Pro development board with Heatsink (3G+16G eMMC)
1 x Acrylic case with screws
1 x 12V-2A power supply
1 x Type C cable
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