TDK InvenSense MOD-CH101 Ultrasonic ToF Sensor Module
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TDK InvenSense MOD-CH101 Ultrasonic ToF Sensor Module

Description of product

Description

TDK InvenSense MOD-CH101 Ultrasonic Time-of-Flight (ToF) Sensor Module contains a CH-101 sensor on a small printed circuit board. Based on Chirp’s patented MEMS technology, the CH-101 is a system-in-package that integrates a PMUT (piezoelectric micromachined ultrasonic transducer) together with an ultra-low-power SoC (system on chip) in a miniature, reflowable package. The SoC runs Chirp’s advanced ultrasonic DSP algorithms and includes an integrated microcontroller that provides digital range readings via I2C. 

The CH-101 provides accurate range measurements to targets at distances up to 1.2m. The sensor works in any lighting conditions, including sunlight by using ultrasonic pulse-echo measurements and provides millimeter-accurate range measurements independent of the target’s color and optical transparency. The sensor’s wide Field-of-View (FoV) enables simultaneous range measurements to multiple objects in the FoV. The MOD_CH101-03-01 sensor module includes an omnidirectional acoustic housing with a 0.7mm diameter acoustic port and a 5.3mm outer diameter.

Features

  • Ultralow power
  • Fast and accurate range measurement regardless of target size
  • Detects any color objects including windows and glass doors and walls
  • Easy to integrate
  • Miniature, integrated module
  • Customizable field of view (FoV)

Applications

  • Augmented and Virtual Reality
  • Drones and Robotics
  • Mobile and Computing Devices
  • Obstacle avoidance
  • Printers and Scanners
  • Proximity sensing
  • Presence detection: always-on sensing to lock/unlock and power on/off notebooks, tablets, white goods, etc.
  • Smart Home