Xilinx SP701 Evaluation Kit is built for designs requiring sensor fusion such as industrial networking, embedded vision, and automotive applications. The evaluation kit is based on the XC7S100FGGA676 device, a member of the Xilinx® 7 Field Programmable Gate Array (FPGA) line of products. The SP701 Evaluation Kit features high I/O availability and I/O expansion capability via Peripheral module interface (Pmods) and FPGA Mezzanine Card (FMC) connectors, making it the largest IP development canvas for Spartan-7 FPGA users. The board is designed for high-performance and lower power with a 28nm, 1V core voltage process. For lower power, the board has a 0.9V core voltage option.
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Xilinx SP701 Evaluation Kit is built for designs requiring sensor fusion such as industrial networking, embedded vision, and automotive applications. The evaluation kit is based on the XC7S100FGGA676 device, a member of the Xilinx® 7 Field Programmable Gate Array (FPGA) line of products. The SP701 Evaluation Kit features high I/O availability and I/O expansion capability via Peripheral module interface (Pmods) and FPGA Mezzanine Card (FMC) connectors, making it the largest IP development canvas for Spartan-7 FPGA users. The board is designed for high-performance and lower power with a 28nm, 1V core voltage process. For lower power, the board has a 0.9V core voltage option.
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