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605ed30de3472935da7fb52f I/O Connectors CAGE ASSEMBLY 1X4 QSFP28 TB //cdn.storehippo.com/s/59c9e4669bd3e7c70c5f5e6c/605ed30de3472935da7fb531/webp/2354935-1_spl.png

Thermal Bridge Technology for I/O Applications

TE Connectivity's Thermal Bridge Technology for Input/Output (I/O) Applications is a mechanical alternative to traditional gap pad or thermal interface material. Thermal Bridge Technology offers superior thermal resistance, while not completely relying on high levels of compression to achieve optimal thermal transfer. This technology features improved thermal resistance, better reliability and durability, and easier serviceability. TE Thermal Bridge Technology is ideal for 5G/Wireless, servers, Ethernet SP routing, and high performance computing (HPC) applications. 

TT-MU-571-2354935-1
in stockINR 19721.39664
TE Connectivity
1 1
I/O Connectors CAGE ASSEMBLY 1X4 QSFP28 TB

I/O Connectors CAGE ASSEMBLY 1X4 QSFP28 TB

Sku: TT-MU-571-2354935-1
₹19,721.4


Sold By: tenettech
Features
  • Shipping in 10-12 Working Days

Description of product

Thermal Bridge Technology for I/O Applications

TE Connectivity's Thermal Bridge Technology for Input/Output (I/O) Applications is a mechanical alternative to traditional gap pad or thermal interface material. Thermal Bridge Technology offers superior thermal resistance, while not completely relying on high levels of compression to achieve optimal thermal transfer. This technology features improved thermal resistance, better reliability and durability, and easier serviceability. TE Thermal Bridge Technology is ideal for 5G/Wireless, servers, Ethernet SP routing, and high performance computing (HPC) applications.