Advanced Thermal Solutions superGRIP™ clipKIT™ Heat Sink Attachments promote a two-component system that quickly and securely mounts heat sinks to a range of hot running Ball Grid Array (BGA) components. These attachments are ideal for densely populated PCBs that have minimal space around components for mechanical attachment. ATS superGRIP heat sink attachments eliminate the need to drill holes, which allows the heat sink to be detached and reattached without damaging the component or PCB in the event the PCB needs to be reworked.
Advanced Thermal Solutions superGRIP™ clipKIT™ Heat Sink Attachments promote a two-component system that quickly and securely mounts heat sinks to a range of hot running Ball Grid Array (BGA) components. These attachments are ideal for densely populated PCBs that have minimal space around components for mechanical attachment. ATS superGRIP heat sink attachments eliminate the need to drill holes, which allows the heat sink to be detached and reattached without damaging the component or PCB in the event the PCB needs to be reworked.
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Tenet Technetronics focuses on “Simplifying Technology for Life” and has been striving to deliver the same from the day of its inception since 2007. Founded by young set of graduates with guidance from ardent professionals and academicians the company focuses on delivering high quality products to its customers at the right cost considering the support and lifelong engagement with customers. “We don’t believe in a sell and forget model “and concentrate and building relationships with customers that accelerates, enhances as well as provides excellence in their next exciting project.