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6068332d73ef58b2aca5f736 FPGA - Field Programmable Gate Array XC7S25-1CSGA324C //d2pyicwmjx3wii.cloudfront.net/s/59c9e4669bd3e7c70c5f5e6c/6068332d73ef58b2aca5f738/webp/csga_324_15x15_dsl.png

Spartan®-7 Field Programmable Gate Arrays

Xilinx Spartan®-7 Field Programmable Gate Arrays feature a MicroBlaze™ soft processor running over 200 DMIPs with 800Mb/s DDR3 support built on 28nm technology. FPGAs are semiconductor devices that are based around a matrix of configurable logic blocks (CLBs) connected via programmable interconnects. The Spartan-7 offer integrated analogue-to-digital converters, dedicated security features, and Q-grade (-40 to +125°C) on all commercial devices. Spartan-7 devices enable key connectivity and processing applications in industrial, automotive, consumer, and communications markets. Spartan-7 is among four FPGA families (Virtex-7, Artix-7, and Kintex-7 are the others) that address system requirements ranging from small form factor, cost-sensitive, high-volume applications to ultra-high-end connectivity bandwidth, logic capacity, and signal-processing capability.

TT-MU-217-XC7S25-1CSGA324C
in stock INR 5065.10752
Xilinx
1 1

FPGA - Field Programmable Gate Array XC7S25-1CSGA324C

Sku: TT-MU-217-XC7S25-1CSGA324C
₹5,065.11


Sold By: tenettech
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Description of product

Spartan®-7 Field Programmable Gate Arrays

Xilinx Spartan®-7 Field Programmable Gate Arrays feature a MicroBlaze™ soft processor running over 200 DMIPs with 800Mb/s DDR3 support built on 28nm technology. FPGAs are semiconductor devices that are based around a matrix of configurable logic blocks (CLBs) connected via programmable interconnects. The Spartan-7 offer integrated analogue-to-digital converters, dedicated security features, and Q-grade (-40 to +125°C) on all commercial devices. Spartan-7 devices enable key connectivity and processing applications in industrial, automotive, consumer, and communications markets. Spartan-7 is among four FPGA families (Virtex-7, Artix-7, and Kintex-7 are the others) that address system requirements ranging from small form factor, cost-sensitive, high-volume applications to ultra-high-end connectivity bandwidth, logic capacity, and signal-processing capability.