Description:

Soder-WickÒ offers the state of the art in desoldering technology. Soder-WickÒ is designed for today’s heat sensitive electronic components using lighter mass, pure copper braid construction that allows for better thermal conductivity, even at low temperatures. Soder-WickÒ responds faster than conventional desoldering braids thereby minimizing overheating and preventing PCB damage. Soder-Wick Rosin has the fastest desoldering action in the industry. Flux residues must be cleaned after the rework process.

Applications:

Soder-WickÒ desoldering braid safely removes solder from:
 Thru-hole Components
SMT Pads and BGA Pads
 Micro Circuits
 Terminals
 Lugs and Posts
 Identification Script