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# 2514/U, 7th 'A' Main Road, Opp. to BBMP Swimming Pool, Hampinagar, Vijayanagar 2nd Stage. Bangalore, IN
+918023404924 https://www.tenettech.com/s/59c9e4669bd3e7c70c5f5e6c/ms.settings/5256837ccc4abf1d39000001/59dafe26aef6e1d20402c4c3-480x480.png" [email protected]
66cf1e90d8856b049d71fbdf CUI Devices 2223-HSB19-272718-ND https://www.tenettech.com/s/59c9e4669bd3e7c70c5f5e6c/66cf1e91d8856b049d71fbe7/mfg_hsb19-272718.jpg

HEAT SINK, BGA, 27 X 27 X 18 MM

Product Attributes:

Series HSB
Product Status Active
Type Top Mount
Package Cooled BGA
Attachment Method Adhesive (Not Included)
Shape Square, Pin Fins
Length 1.063" (27.00mm)
Width 1.063" (27.00mm)
Diameter -
Fin Height 0.709" (18.00mm)
Power Dissipation @ Temperature Rise 6.8W @ 75°C
Thermal Resistance @ Forced Air Flow 4.50°C/W @ 200 LFM
Thermal Resistance @ Natural 11.11°C/W
Material Aluminum Alloy
Material Finish Black Anodized
TT-DKEY-2223-HSB19-272718-ND
in stock INR 277.92
CUI Devices
1 1
CUI Devices 2223-HSB19-272718-ND

CUI Devices 2223-HSB19-272718-ND

Sku: TT-DKEY-2223-HSB19-272718-ND
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₹277.92
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Sold By: tenettech
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Description of product

HEAT SINK, BGA, 27 X 27 X 18 MM

Product Attributes:

Series HSB
Product Status Active
Type Top Mount
Package Cooled BGA
Attachment Method Adhesive (Not Included)
Shape Square, Pin Fins
Length 1.063" (27.00mm)
Width 1.063" (27.00mm)
Diameter -
Fin Height 0.709" (18.00mm)
Power Dissipation @ Temperature Rise 6.8W @ 75°C
Thermal Resistance @ Forced Air Flow 4.50°C/W @ 200 LFM
Thermal Resistance @ Natural 11.11°C/W
Material Aluminum Alloy
Material Finish Black Anodized

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